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当前所在位置:首页 >产品中心>激光切割机

激光精密陶瓷打孔切割设备——Laser Precision Ceramic Drilling

产品特点:

设备介绍 PRODUCT DESCRIPTION

目前陶瓷基板的高散热性能及稳定性越来越受到大功率器件的青睐, 为了满足陶瓷基板的高速打孔及划线\切割需求, 雷火竞猜特推出了双工位激光精密陶瓷打孔切割专用机M3。

该设备使用高功率、长寿命的光纤激光器为光源,可以轻松实现 打孔、划线及切割的需求。 为了进一步提高设备的使用效率,特配置了双工位工作台,最大限度的提高操作效率。

At present, the high heat dissipation performance and stability of ceramic substrate are more and more favored by high-power devices. In order to meet the needs of high-speed drilling and marking of ceramic substrate, we have introduced a special machine for dual-station laser precision ceramic drilling and cutting.

The device uses a high-power and long-life optical fiber laser as a source, so that the requirements of drilling, marking and cutting can be easily realized. In order to further improve the use efficiency of the equipment, the double-station working table is specially configured, and the operation efficiency is improved to the maximum extent.



详细介绍

技术参数

项目

参数

型号 Model

M3

激光波长 Wavelength

~1070nm

峰值功率 Peak Power

1500W

平均功率 Average Power

200W

切割方式 Cutting Method

切割头 Cutting Head

工作行程 Working Area

400X400mm

工位 Station

2(满足 5 寸)

设备尺

Machine Dimension

1400X1250X1650mm

工作电压/功率 Voltage/Power

380VAC /~3KW

重量 Weight

1200kg

加工效果



技术特征 


高功率长寿命工业光纤激光器

激光器性能稳定,光斑质量好,可满足板陶瓷应用的绝大多数切割应用

龙门双驱平台,结构紧凑、工作效率高

友好的设备操作软件

基于 Windows 的操作界面,操作简单、友好

自动匹配靶标,多数靶标不需要设置;一次加工接受不同直径靶标

自动涨缩补偿

适合皮秒等超短脉冲激光高频的脉冲控制、深度控制功能

加工过程焦点自动补偿功能

加工过程,散热控制功能

全幅面精度补偿

用户分级管理

加工参数分级管理

功率补偿功能

配合自动化

专业软件优化/生成切割路径

可解析多种常用文件格式,同时具备图形优化及特殊功能的路径生成功能。

图形靶标自动识别

双工位工作台

PRODUCTFEATURES

High power and long life industrial fiber laser

The laser has stable performance and good spot quality, which can meet the needs of most cutting applications of plate ceramics.

The gantry double-drive platform has the advantages of compact structure and high working efficiency.

The operation interface based on Windows is simple and friendly.

Automatic matching target, most targets do not need to be set; accept different diameter targets in one processing.

Automatic compensation for fluctuation and contraction.

Suitable for picosecond and other ultra-short pulse laser high frequency pulse control and depth control function.

Automatic compensation function during processing.

Heat dissipation control function during processing.

Full-breadth precision compensation.

User hierarchical management.

Hierarchical management of processing parameters.

Power compensation function. 

Professional software optimization/ generation of cutting path

Can resolve a variety of common file formats, and have the path generation capability of drawing optimization and special functions.

Image target automatic identification.

Double station worktable.